Silicon Photonics and Advanced Packaging for AI Computing: From Optical Interconnects to Co-Packaged Optics_Events | Taiwan Semiconductor & Optronics Materials Devices Association

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Silicon Photonics and Advanced Packaging for AI Computing: From Optical Interconnects to Co-Packaged Optics

Date2026/09/16
Time09:30~16:30
Venue新竹工研院中興院區51館2C訓練教室

課程特色

本課程旨在建立學員對矽光子（Silicon Photonics）技術的完整認識，涵蓋矽光子發展趨勢、市場分析與產業應用，說明光互連取代銅線傳輸的技術優勢，以及光子積體電路（PIC）與電子積體電路（EIC）的整合架構。

同時，介紹半導體封裝與先進封裝技術、共同封裝光學（Co-Packaged Optics, CPO）的設計概念及應用，並探討矽光子最新研究方向與未來發展趨勢，培養學員掌握高速光通訊、AI資料中心及光電整合系統之核心技術與產業發展能力。

適合對象

1. 對矽光子有興趣的人員 2. 半導體相關研究人員

Course title

Silicon Photonics and Advanced Packaging for AI Computing: From Optical Interconnects to Co-Packaged Optics

Early-bird registration time

2026/07/16 00:00 ~
2026/08/21 23:59

Registration fee

Early bird price$5,000(≈ USD 152.85)/People

Agenda

Time

Topic

Speaker

9:30-16:30

1. Introduction to Silicon Photonics

2. Silicon Photonics Market Analysis and application

3. Optical Interconnects Replacing Copper Links

4. Photonic Integrated Circuit and Electrical Integrated Circuit

5. Introduction to Semiconductor Packaging Technology

6. Advanced packaging technology and Co-Packaged Optics

7. Research and exploration of Silicon Photonics

葉志庭教授
國立中正大學光機電整合工程所
學歷：
▸ 國立交通大學光電工程博士
經歷：
▸ 業界經歷14.8年
▸ 勝華科技模組產品部背光與照明課長
▸ 璨圓光電股份有限公司（合併晶元光電）總經理室專案處長
▸ SGS台灣檢驗科技光學安規檢測實驗室副理及報告簽署人
▸ 宏齊科技股份有限公司前瞻技術研發中心技術長
榮譽、專利、論文：
▸ 國科會114優秀年輕學者研究計畫
▸ 國科會115青穗學者計畫
▸ 專利國內外已獲證214件
▸ SCI paper 43篇

葉志庭教授
國立中正大學光機電整合工程所

學歷：
▸ 國立交通大學光電工程博士

經歷：
▸ 業界經歷14.8年
▸ 勝華科技模組產品部背光與照明課長
▸ 璨圓光電股份有限公司（合併晶元光電）總經理室專案處長
▸ SGS台灣檢驗科技光學安規檢測實驗室副理及報告簽署人
▸ 宏齊科技股份有限公司前瞻技術研發中心技術長

榮譽、專利、論文：
▸ 國科會114優秀年輕學者研究計畫
▸ 國科會115青穗學者計畫
▸ 專利國內外已獲證214件
▸ SCI paper 43篇

Notice

Registration Fee

Company Affiliation	Regular Fee	Early Bird Fee
TSOMDA Member	NT 4,500	NT 4,000
Non-member	NT 5,500	NT 5,000

▸ Early Bird Deadline: Register and complete payment by August 21, 2026 (Friday) to enjoy the early bird rate. Registrations completed after the deadline will be charged at the regular rate.
▸ Registration Deadline: September 13, 2026 (Sunday).
▸ Registration fee includes printed course materials and lunch.
▸ The member rate applies to all employees of TSOMDA member companies.
▸ Membership eligibility is determined by the company's Business Administration Number (Unified Business Number, UBN). Subsidiaries or affiliated companies are not eligible for member pricing unless they hold an independent TSOMDA membership.

▸ ITRI employees: Please specify your institute/division in the Company Name field (e.g., ITRI Material and Chemical Research Laboratories).

Payment Information

Bank: 台灣土地銀行工研院分行
Account No.: 156-001-000-195
銀行代碼：005
Account Name: 台灣半導體與光電材料元件產業協會
▸ Payment may be made by bank transfer, online banking transfer, or ATM transfer.
▸ After completing the payment, please email us the last five digits of your remittance account (or other payment details) for payment verification.

Cancellation & Refund Policy

If you wish to cancel your registration, please notify the organizer by email.

▸ Cancellation made 7 days or more before the course date: Full refund (less any applicable administrative or incurred expenses).

▸ Cancellation made 3 to 6 days before the course date: 80% of the registration fee will be refunded.

▸ Cancellation made within 3 days of the course date, or failure to notify the organizer: No refund will be issued. Printed course materials will be mailed to the registered participant.

Contact Information

Taiwan Semiconductor and Optronics Materials Devices Association (TSOMDA)
Ms. He Tel: 03-5821699 ext. 10 E-mail：YilingHe@tsomda.org.tw
Ms. Chen Tel: 03-5821699 ext. 12 E-mail：ShallyChen@tsomda.org.tw

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